Dresden / Radeberg, Germany
Dresden: New potting system
In order to fulfil the increasing quality requirements in the field of electronics production and to further increase the level of automation, Cicor Deutschland in Dresden has invested in an automated 2K moulding system from Altlas Copco (formerly Scheugenpflug). The commissioning is a further milestone in the continuous investment in modern production technologies.
The encapsulation reliably protects electronic components from harmful environmental influences. The fully or partially encapsulated assemblies are highly resistant to moisture, dust and chemical substances. At the same time, the potting compound provides effective mechanical protection by shielding sensitive parts from vibrations and external shocks. In addition, the potting compound ensures reliable electrical insulation, which significantly reduces the risk of short circuits and increases operational safety. This is becoming increasingly important, particularly in demanding environments in the automotive, aviation and industrial electronics sectors.
The realisation of a stable potting process requires precise dosing technology, controlled process parameters and the use of high-quality potting material. The 2-component potting compound Wepuran VU4452/61HE from Peters is used in this system. Many process parameters such as the degassing and mixing of the components, the mixing ratio and the exact dosage must be precisely coordinated in order to avoid air inclusions, insufficient curing or other defects. High process reliability and monitoring ensure exactly reproducible results.
A key focus of this system is on automation. Depending on the product, the machine works completely autonomously for up to 40 minutes; a production employee is only required to insert and remove the assemblies. The sequence of work steps has been optimised so that unnecessary handling of the assemblies can be avoided through the continuous use of workpiece carriers.
The integrated material locking function with direct connection to the ERP system ensures additional process reliability. This ensures that there is no mix-up of components when filling the system. At the same time, the shelf life of the potting compound used is continuously monitored.
The investment in the new potting system is part of the strategic orientation of the Cicor site in Dresden to integrate technological innovations into the existing production processes in a targeted manner. This not only strengthens the basis for even higher product quality, but also the company's position as a reliable partner for future-proof electronics solutions.
Julia Stukert and Thomas Schönfeld
Engineering
Radeberg: Investment in a new YRM20-10 SMT placement machine
A key component of electronics production at the Radeberg site is the SMT line, on which the technologies used here, such as chip and wire bonding or thick-film technology, can be combined with SMD assembly. After many years of using the existing Juki placement machines, it was time for renewal. The aim was to improve the cycle time and performance of the systems.
After careful comparison of systems and concepts from various suppliers, a placement machine from the Japanese manufacturer Yamaha was selected and procured. The configuration of the system was designed to meet the typical production requirements of the site, which demand flexibility and fast set-up times combined with high placement speeds. With a placement performance of up to 60,000 components per hour, the system can replace the two previously used systems and achieve a reduction in cycle time. The speed is achieved through the simultaneous placement of two panels with two independent working heads, each with 10 nozzles. The placement accuracy is also improved to +/- 25 µm, so that smaller components than the CR01005 chip format (edge length 0.4 x 0.2 mm) can also be processed in future.
A total of 96 slots are available for 8 mm feeders. The maximum number of components that can be configured is correspondingly high. The number is reduced when wider feeders are used. The feeders are driven electrically so that the belt feed can be flexibly adjusted. Components supplied in trays can be processed with a corresponding tray system. There are 10 automatically selectable trays available for this purpose. PCB labels can be applied fully automatically using a label feeder. There is also a high degree of flexibility when it comes to the size of the panels: the minimum size for the pick and place machine is 50 x 50 mm and can be up to 810 x 510 mm.
As part of the system installation, the SMT line was relocated to a class 7 clean room in accordance with EN ISO 14644-1 in order to better meet the high technical cleanliness requirements of products in the medical and aerospace sectors. By integrating an 8-zone reflow oven from the manufacturer Rehm into the new line, it will be possible to realize more finely tuned solder profiles in the future.
The installation of the new Yamaha placement machine has already been completed. Following internal approval and set-up of the products on the new system, this will provide us with improved production conditions. The reduction in space from two to one placement machine means that the line can be equipped with additional systems, such as an SPI, in the future.
With this investment, Cicor RHe Microsystems GmbH continues to guarantee long-term production reliability for assemblies for the aerospace, medical and industrial electronics sectors and is well equipped for current and future requirements.
Dipl.-Ing. Michael Heinrich / Dr. Max Frömmig
Team Engineering